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Here are examples of some of my work.  The information has been edited to protect proprietary information.

 

Temperature Gradient Induced Stress and Strain

 

        Plastic Polymer Injection Mold  - FEA using flexPDE

 

Heat Flux in a Silicon MEMS Wafer with Internal Heat Source

 

        Heat Flux in a MEMS WAFER - FEA using flexPDE

Comments Regarding my Heat and Thermal Flux Design and Analysis Work:

The measurement and analysis of temperature and heat flow in electrophysical systems becomes necessary in many circumstances.  Over the years, I have done a fair amount of thermal measurement and analysis, with more recent work being related to the stresses and strains induced by temperature gradients in bolted and adhesively bonded micro-fluidic structures.

 

The analysis of heat flux generated stress and strain is inherently "multiphysics" ... the various fields to be solved for being cross-coupled.  Often, as in the case for thermal gradient induced buoyant fluid flow, the partial differential equations are highly non-linear.  In any case, an extra layer of interesting physics is introduced when the media through which the fields propagate are non-isotropic.  I have made finite element analysis ( FEA ) studies for these and other cases of practical use in applied science and engineering.

 

Also, I once extensively modified and temperature calibrated a video camera with near infrared sensing capability, to allow its use in monitoring a huge pulp and paper mill Kraft Recovery furnace.

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