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Here are a few examples of my work.  The information has been edited to protect proprietary information.

 

Electrolytic Porous Silicon Etching

 

        Etching Cell for 100 mm Wafers

Silicon Properties Measurement for MEMS Applications

 

        Non-Contacting NDT Conductivity Sensor - FEA using flexPDE

 

        Non-Contacting Microwave NDT Conductivity Measurement

Comments Regarding my Porous Silicon and MEMS Related Design and Analysis Work:

For seven years I worked as a micro fuel cell engineer designing direct methanol fuel cells.  The substrate material chosen for the electrochemical cells that generate electricity was silicon.  For various reasons, it was useful to electrochemically etch regions of silicon wafers so as to create porous regions. In the course of this work, I learned a fair amount about silicon, porous silicon and MEMS methods of fabrication and analysis.

 

One of the larger and more complex systems I became involved with, and subsequently designed many key subassemblies for, was an electrolytic chemical etching system which formed porous regions in 100 mm diameter silicon wafers.  I designed a large area, high intensity infrared illuminator, fluidic chambers, flow-paths and the electronic power supply system which, under computer control provides current, in just the right way, to the etching cell.

 

Being an electrical engineer (MSEE) with substantial "at the bench" experience, I also designed a non-contacting sensor-instrument system for measuring the electrical conductivity of silicon wafers.  To optimize my sensing head design, I made a helpful finite element analysis ( FEA ) model using flexPDE. This "eddy current" based instrument was highly useful on several projects.

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