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Here are a few examples of my work.  The information has been edited to protect proprietary information.

 

Temperature Gradient Induced Stress and Strain

 

        Plastic Polymer Injection Mold  - FEA using flexPDE

               Stress and Strain in Anodic Bonded MEMS Structure

Vibration Induced Stress and Strain

 

        Acoustic Transducer Faceplate Wedge Stress and Strain

 Comments Regarding my Stress and Strain Design and Analysis Work:

The analysis of stress and strain in MEMS and electro-physical systems becomes necessary in many circumstances.  Over the years, I have done a fair amount of stress analysis with more recent work being related to the stresses and strains induced by temperature gradients in bolted and bonded structures.

 

The analysis of heat flux generated stress and strain is inherently "multiphysics." The various fields to be solved for are cross-coupled.  Often, as in the case for thermal gradient induced buoyant fluid flow, the partial differential equations are highly non-linear.  An extra layer of interesting physics is introduced when the media through which the fields propagate are non-isotropic.  I have made finite element analysis ( FEA ) studies for these and other cases of practical use in applied science and engineering.

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